超声波加工工程陶瓷孔的研究

Study on the ultrasonic machining holes in ceramics

对超声波加工工程陶瓷孔进行了研究 ,分析了材料去除机理 ,建立了超声波加工工程陶瓷孔时的材料去除率模型。由公式知 :材料去除率随静载荷、工具振幅、磨粒直径的增大而增大 ,随着材料断裂韧性和硬度的升高而降低 。

In this paper, the method of machining holes in engineering ceramics with ultrasonic is studied. The mechanism of material removal is analysed and a theoritical model of material removal rate (MRR) is proposed. The formula shows that any increase of static load, the amplitude of tool, the size of grain or decline of toughness and hardness of material will result in an increase of MRR. The theoritical formula of the MRR is tested.