摘要
本文通过有限单元法对E型硅杯进行应力分析,研究E型硅杯的结构偏差对膜片应力分布的影响,进而给出E型硅杯的结构偏差与膜片应力非线性度的关系。
In this paper,the stress analysis of E-style silicaon wafer by the method of finite element is given.Also the influence of the structure deviation of E-style silicon wafer from to its stress distribution is discussed,and the relation between structure deviation and stress nomlinearity is presented.
出处
《仪表技术与传感器》
CSCD
北大核心
1998年第1期32-33,38,共3页
Instrument Technique and Sensor