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单晶硅棒切方专用金刚石外圆切割片技术要求及制造工艺探讨 被引量:2

Discussion on technical specifications and manufacturing technologies of diamond external cutting blade specially applied to the monocrystalline silicon slicing
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摘要 文章对单晶硅棒切方专用金刚石外圆切割片的技术要求及制造工艺进行了探讨。在金刚石外圆切割片制造工艺中,采用双层电沉积法制造金刚石外圆切割片,对基体材料、刃口厚度、偏摆度、工艺规范及金刚石的选用处理都有严格的要求:选用高性能工具钢为基体材料,进行尺寸、偏摆度及应力控制;合理的工艺规范使制造出的切割片具有足够高的韧性和抗冲击能力,使金刚石发挥出最佳的磨削效果;选用适宜金刚石,并对金刚石粒度及表面进行处理,使金刚石出刃均匀,且与电沉积层紧密结合,提高使用寿命。 It has discussed the technical specifications and manufacturing technologies for the diamond external cutting blade which is specially applied to the monocrystalline silicon slicing in this paper. In the manufacturing technologies of diamond external cutting blade, the double-electrodepositing technology is used for the production of the blade, and some special requirements are asked for to the materials of the matrix, the thickness of the edge, the side-runout of the blade, technical processing as well as the selection of diamond abrasive and its special treatment and processing. Selecting the tool steel with high quality as the matrix materials, controlling strictly the dimensions, stress and side-runout of the matrix, and properly processing technologies ensure the blade to have enough toughness and anti-impact ability and make the diamond grains perform best. Choosing right diamond abrasive and carrying on proper processing on the diamond grains with their surfaces will make the diamond grains expose well and combined tightly with the electrodepositing materials during the working so that the working life is extended.
出处 《超硬材料工程》 CAS 2008年第6期12-16,共5页 Superhard Material Engineering
关键词 单晶硅 金刚石外圆切割片 双层电沉积 综述 表面处理 monocrystalline silicon diamond external cutting blade double electrodeposition review surface treatment
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  • 1[2]http://www.materials.net.cn/Html/xxnews/20076/20076613565233511.html.

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