IC封装焊头机构接触力分析

Contact force analysis for IC bonder

针对IC封装焊头机构(bonder)高速运动、精密定位、微接触力的要求,运用虚拟样机技术,建立焊头机构虚拟样机模型。通过虚拟仿真,揭示了焊头部件的运动和动力学规律。为了保证取晶和固晶时的接触力要求,对弹簧参数和焊头与晶圆、引线框架的间隙进行优化。结果表明,焊头的位移控制精度则直接影响到接触力的大小,弹簧刚度则不仅影响接触力的大小,还影响它的稳定性。

Aimed at the high speed,high accuracy positioning and micro contact force requirements for IC bonder,the bonder was modeled using virtual prototype technique. The kinematics and dynamics had been revealed by simulation. The parameter af spring,the distances between bonder and wafer,bonder and lead frame were optimized with contact force constrains for bonding and picking. The results show that the positioning accuracy affect the magnitude of the contact force,while the stiffness of spring affect both the magnitude and the stability of the contact force.