世界覆铜板新品种新技术赏析(2)——松下电工兼容无铅焊接的高耐热低介质损耗的PCB基板材料R-2125

Analysis of New Variety and Technology of Copper Clad Laminates Worldwide(2)——High Heat Resistance and Low Dielectric Loss PCB Material R-2125 of Matsushita Electric Works Compatible for Lead-Free Soldering

文章介绍了松下电工PCB基板材料的发展战略,分析了最新推出的R-2125的树脂体系设计与特点,同时综述了R-2125的诸多性能。

In the paper, development stratagem of PCB substrate material of Matsushita electric works, Ltd. was introduced. Resin system design and characteristic of the newest type R-2125 were analyzed. At the same, a great deal of performance of R-2125 were reviewed.