摘要
对无氰碱性镀铜镀液成分及镀层性能研究,获得了一种可以在铁基元件上直接镀铜的电镀工艺;研究了各成分对镀层性能的影响,获得了最佳工艺配比.对该新型镀铜工艺在铁基上的镀铜效果、均镀能力、深镀能力和镀层结合力分别进行研究,结果表明该工艺所得镀层与基体结合力良好,镀液工艺简单,容易控制,电流效率高,可以用来作为铁基元件镀铜层的打底和加厚.
By studing the composition and properties of the cyanide-free alkaline copper plating, a new copper electroplating process is derived which can directly operate on the iron-based components. The optimal coating composition is obtained through orthogonal experiment. The results show that based on this new process, the binding of the coating to the substrate is good. The new process is simple, easy to control. Besides, the current efficiency is high. The process can be used to thicken the layer of the iron-based components.
出处
《江南大学学报（自然科学版）》
CAS
2008年第6期684-687,共4页
Joural of Jiangnan University (Natural Science Edition)
基金
江苏省自然科学基金项目(BK2004020)
教育部重点项目(教外字[2006]233号)
教育部回国人员启动基金项目(教外字留[2004]527号)
无锡市产学研项目(DY050007)
清华大学摩擦学国家重点实验室开放基金项目(SKLT04-06)
江南大学重大基金项目(207000-21054200)
关键词
铁基元件
无氰镀铜
电流效率
iron-based components
cyanide-free copper
current efficiency
