正性光敏聚酰亚胺研究与应用进展(一)

Research and Development of Positive-working Photosensitive Polyimides(1)

正性光敏聚酰亚胺(p-PSPI)是一类重要的集成电路(IC)封装材料,广泛用于IC器件的应力缓冲、表面钝化以及层间绝缘。与传统的负性光敏聚酰亚胺(n-PSPI)相比,p-PSPI无论在光刻精度还是环境友好性方面均表现出了更为优良的品质。文章综述了国内外p-PSPI电子封装材料的最新研究与应用进展状况。系统阐述了p-PSPI的光化学机理。对目前商业化p-PSPI产品的特性、在微电子以及光电子领域的应用和未来发展趋势进行了介绍。最后对国内高性能p-PSPI电子材料的研发工作提出了建议。

Positive-working photosensitive polyimides （p-PSPIs） are a type of important integrated circuit （IC） packaging materials and have been widely utilized as the stress buffer coating, passivation layer, and interlayer dielectrics for IC devices, p-PSPIs exhibit higher photosensitivity and better environmental compatibility compared with negative PSPIs （n-PSPIs）. The recent research and development ofp-PSPIs have been summarized in this paper. The photochemical reaction mechanisms ofp-PSPIs were presented. The characteristics, applications in microelectronic and optoelectronic fields, and the future developing trends of commercial p- PSPIs were introduced. At last, some suggestions were proposed for the research and development of the domestic p-PSPI industry.