摘要
大功率LED器件的结温是其热性能的重要指标之一,温度对LED的可靠性产生重要的影响。采用板上封装的方法,利用大功率芯片结合金属基板封装出了大功率白光LED样品,利用LED光强分布测试仪测试了器件的I-V曲线,用正向电压法测量了器件的温度敏感系数,进而通过测量与计算得到器件的结温和热阻。最后利用有限元对器件进行实体建模,获得了器件的温度场分布。测量结果表明:正向电压与结温有很好的线性关系,温度敏感系数为2mV·℃-1,LED的结温为80℃,热阻为13℃·W-1。有限元模拟的结果与实测值具有良好的一致性。
Junction temperature is one of the most important indexs for thermal performance, temperature has a significant effect on the reliability of LED. Based on chip-on-board package, a high-power white LED sample was made using high-power chip and metal substrate, the IV curve was measured using LED luminous intensity distribution test, the temperature sensitive parameter was measured by forward voltage method, junction temperature and thermal resistance were got by measuring and counting. Entity model of the LED was designed via finite element, the temperature distribution was acquired. Survey results show that the forward voltage depends on the junction temperature linearly, temperature sensitive parameter, junction temperature and thermal resistande of the LED is 2 inV. ℃^-1, 80 ℃, 13 ℃.W^-1 respectively. Finite element simulative value is consistent with measured results.
出处
《电子与封装》
2008年第12期10-12,16,共4页
Electronics & Packaging
基金
河南省重点科技攻关资助项目(072102240027)
河南理工大学博士基金资助项目(648602)
河南理工大学研究生学位论文创新基金资助项目(644005)
关键词
大功率LED
结温
热阻
有限元
high-power LED
junction temperature
thermal resistance
finite element analysis
