单晶硅高速走丝电火花线切割试验研究

Experimental Research of WEDM-HS on Monocrystal Silicon Cutting

研究了基于复合工作液的高速走丝电火花线切割(W EDM-HS)对单晶硅切割的形貌特征及工艺规律。试验表明W EDM-HS对低电阻率单晶硅切割具有效率高、切缝窄、厚度薄且无明显表面微裂纹等特性,在硅表面放电凹坑内由于高温电解作用会形成密集、壁面光滑且高深径比的微孔洞结构。该工艺将在宏观方面为单晶硅大尺寸超薄高效切割,在微观方面为在单晶硅上加工出具有高深径比微孔洞结构提供研究思路。

Morphology feature and processing rule of cut mono-crystal silicon（mc-Si） based on complex dielectric fluid used in wire cut electric discharge machining with high traveling speed （WEDM-HS）is researched. The result shows that WEDM-HS processes on mc-Si with low resistivity have good characteristics of the high efficiency, thin thickness, narrow gap, no obvious surface micro-cracks, and dense microporous with smooth wall and high aspect ratio because of high-temperature electrolysis on surface discharge dents. Large size and ultra-thin mc-Si cutting is innovated in the macroscopic aspect. The processing microporous structure with high aspect ratio on silicon materials is developed on the microscopic aspect.