双热流计稳态法材料导热性能测试装置与分析

Thermal Conductivity Measuring of Solid State Materials by Steady-State Bi-substrate Technique

在分析多层平板一维稳态热传导过程的基础上，确定了双热流计结构一维稳态热传导的物理模型和实现一维稳态热传导的技术条件，设计制作了一套可用于材料导热性能测试的双热流计实验装置。采用C＋＋编制了可运行于Windows环境下的测试和数据处理软件，利用导热系数已知的三组试样：石英玻璃、聚苯乙烯、含碳0．45％钢在所研制的实验装置上进行了导热系数测试分析。实验结果表明，对于导热系数介于1～10w／mK的材料，测试结果与文献报道数值吻合得很好。测试结果的重复性也比较好。可以满足实际工程导热系数测量的需要。

Based on the principle of unidirectional steady-state technique of multi-layered plate, the physical model and technical processing of unidirectional steady-state bi-substrate heat flow are realized, and a measuring apparatus for thermal conductivity of solid state materials using steady-state bi-substrate technique is developed. Thermal conductivity testing and data processing software in Windows operation system are developed using Visual C＋＋ computer language. The accuracy and the operability with the apparatus are verified by the fused quartz glass, PS and the indicated steel with carbon content 0.45 samples. Results indicate that for materials with thermal conductivity 1-10 W/m · k, the measurement results fit well with that of known literature references and the good reproducibility is also reached. Thus the requirements of engineering application meet well.