薄膜混合微电路返工工艺研究

Rework technology for tin film HIC

混合微电路的返工和返修是降低生产成本的重要手段之一。由于引进了表面安装技术和片式元器件，返工和返修已可以实现。试验证明，经两次返工，两次高温烘烤后，仍可获得合格的混合微电路。

Rework and repair are important means for reducing the manufacture cost The employment of surface mounting and SMD make possible the rework and repair Experiments show that even through two rework processes, a qualified HIC still can be acquaired (no refs )