铜基电子封装材料研究进展

Progress of Research on Cu-based Electronic Packaging Materials

介绍了国内外铜基电子封装材料的研究现状及最新发展动态,指出了目前我国新型铜基电子封装材料研究中所存在的问题及进一步完善的措施,预测了电子封装用铜基复合材料的发展趋势和应用前景.未来的铜基电子封装材料将朝着高性能、低成本、轻量化和集成化的方向发展.

The characteristics, present status, application prospect and existing problems of copper-matrix composites for electronic packaging are described. The problems and their improving methods of new electronic packaging materials used in our country are discussed. And the developing tendency of copper matrix electronic packaging materials is forecasted. It is believed that high performance, low cost, light weight and integration will be the future characteristics of copper matrix electronic packaging materials.