微波功率电路的热电耦合CAD研究

Investigation on the Coupled Thermal and Electrical CADof Microwave Power Circuits

本文提出了一种新的方法用于微波功率电路的热电一体化设计。该方法是谐波平衡技术的扩展，其特点是能够同时模拟功率电路的电性能和电路中有源器件的结温，并具有很好的计算效率，该方法已实现在通用微波４卜线性模拟软件中。一个Ｃ波段功率放大器的模拟和测量结果的比较证实了本文方法较传统的电学ＣＡＤ方法更为精确和全面。

A novel approach to integrate thermal and electrical CAD of microwave power circuits is presented. The technique is an extension of harmonic balance method. Its advantage is that it can efficiently simulate both the circuit electrical performance and active device junction temperature simultaneously. The approach has been implemented in Microwave Nonlinear Simulator. The comparisons between simulated and measured results for a C band power amplifier are done. It has been demonstrated that this new method is more accurate and effective than traditional electrical CAD technique.