SnAgCuRE钎料合金的力学性能及其钎焊接头的组织与性能

Strength Property of SnAgCuRE Solder Alloy and Its Joint Microstructure and Property

对真空条件下制备的SnAgCuRE钎料合金的力学性能及其钎焊接头的组织与性能进行了研究。试验结果表明:当稀土(RE)的添加量小于0.1%(质量百分比)时,RE均匀地分布在钎料合金中,减少了共晶组织的比例,同时细化富Sn相,提高了其力学性能。接头处钎料与Cu试样间的界面层厚度会由于RE的加入而发生变化,且在添加量小于0.1%时其厚度减小同时界面层更加平滑,此时接头的剪切强度达最大值36MPa。

The strength property of the material and its microstructure and strength property of the joint are researched based on the SnAgCuRE solder alloy fabricated under vacuum condition. The experiment shows that when the RE content is less than 0. 1% （ mass percent）, RE distributes uniformly in the solder alloy, the rate of eutectic structure decreases and the Sn phase thins, the tensile strength of the solder alloy increases. In the joint of the thickness of the intermediate compounds （IMC） between solder alloy and copper board can decrease when the RE content is 0. 1%, which can increase the shear strength up to 36MPa.