0201/01005组件装配工艺技术研究

The Research of 0201/01005 Assembly Process

当今组件封装技术正日新月异,以满足不断快速增长的电子产品的需求。0201/01005是现代电子组装技术的新概念,它能大幅度降低电子产品体积。0201/01005封装由于组件尺寸小,有许多专门的装配注意事项。本文从线路板设计、焊膏选择、贴装控制等几个方面浅谈0201/01005组件装配工艺技术。

Nowadays, chip package technology are developing faster and faster in order to meet the need progress of electronic products. 0201/01005 package is a new concept of contemporary assembly technology, of rapid and it can greatly reduce the volume of electronic products. Due to its small size, 0201/01005 package has special assembly considerations. The article introduces 0201/01005 assembly process, including PCB design, the selection of solder paste and placement control, etc.