八马来酰亚胺基苯基POSS/BT树脂固化行为

The curing behavior of octa (maleimidophenyl) silsesquioxane (OMPS)/BT composites

合成了八马来酰亚胺基苯基POSS(OMPS),并对产物进行了测试表征。将OMPS与4,4′-双马来酰亚胺基二苯甲烷(BMI)/双酚A型氰酸酯(BCE)(BT树脂)进行共混,差示量热扫描仪(DSC)和傅立叶红外光谱仪(FT-IR)测试结果表明,在220℃左右,OMPS/BT树脂固化反应能充分进行;在140～220℃范围内分段固化,动态粘弹分析仪(DMA)测试结果显示固化后树脂的Tg不高,250℃下固化1h后,DMA测试结果显示Tg有明显提高。OMPS/BT树脂复合材料的介电测试结果显示,加入适量的OMPS能明显降低BT树脂的介电常数。

Octa（maleimidophenyl）silsesquioxane （OMPS） has been synthesized and characterized, and the bismaleimidetriazine （BT） resin composed of 4, 4＇-bismaleimidodiphenylmethane （ BMI ） and 2, 2＇-bis-（ 4- cyanatophenyl）propane （BCE） has been prepared. The results of DSC and FT-IR measurements showed that the curing reaction of an OMPS/BT composite was complete at 220 ℃. Curing of the OMPS/BT resins in the temperature range 140- 220℃ was followed by dynamic mechanical analysis （DMA）, and the results demonstrated the values of Tg were not as high as previously reported, suggesting that the curing process was not complete. Therefore the resins were treated by post-curing at 250℃ for 1 h, after which their Tg values were significantly increased The dielectric constants of OMPS/BT composites were markedly reduced by the incorporation of appropriate amounts of OMPS, while excess OMPS had a disadvantageous effect on dielectric constant as a resuit of its aggregation.