用于RFID标签封装的ACA的制备及性能研究

The preparation of an ACA used in RFID tag inlays packaging and its performance

把μm级银粉、潜伏性固化剂等混入热固性环氧树脂,制备出各向异性导电胶,并采用倒装芯片技术,通过热压固化工艺,对RFID电子标签进行封装.通过对导电银粉形貌、连接点微观形貌、胶水的固化曲线、Tg曲线、绑定强度和韧性实验、湿热加速老化实验(85℃,85%RH)的研究来分析该各向异性导电胶的性能.结果发现:银粉颗粒为具有粗糙表面的球形,粒径均一,平均粒径为3.0μm,能均匀分散在树脂中.在180℃,12 s,1.4 MPa热压条件下,制备的ACA能够成功应用于RFID标签的封装;胶水有较低的固化温度(固化峰为127.7℃)和较快的固化速率(ΔT为50℃)及较好的耐热性能(Tg为135.4℃);胶水有较强的绑定强度和韧性及较好的耐湿热性能.通过与国外同类产品(Delo AC163)比较,制备出的各向异性导电胶达到国外同类产品AC163的性能,适合大规模低成本RFID标签的封装.

An anisotropic conductive adhesive （ACA）was prepared by mixing micro-sized Ag particles, latent curing agent and additives into thermo-set epoxy resin. Flexible radio frequency identification （RFID） tag inlays were assembled by ACA with flip chip technology. Silver powders, microstructure of ACA bonding joints, curing profile and thermal stability of the adhesive, bonding strength and toughness test and hot humidity test （85 ℃, 85 %RH） were emp particles were spherical and uniform, and the mean diameter was 3 oyed. It was found that the silver μm. The adhesive could be successfully used in the assembling the RFID tag inlays. And the adhesive had low curing temperature （the temperature of curing peak was 127.7 ℃）, high curing rate （AT was 50 ℃） and good anti-heat performance （the Tg was 135.4 ℃）. The adhesive had good bonding strength and toughness and anti hot humidity capacity too from the results of the other tests. Compared with the foreign product （Delo AC163）, it was found that the performance of ACA prepared here reached the same level or even surpassed that of AC163. In a word, the ACA prepared here was suitable to assemble the RFID tags on alarge scale.