摘要
铜丝引线键合有望取代金丝引线键合,在集成电路封装中获得大规模应用。论文从键合工艺、接头强度评估、键合机理以及最新的研究手段等方面简述了近年来铜丝引线键合技术的发展情况,讨论了现有研究的成果和不足,指出了未来铜丝引线键合技术的研究发展方向,对铜丝在集成电路封装中的大规模应用以及半导体集成电路工业在国内高水平和快速发展具有重要的意义。
Copper wire bonding is considered to be able to replacing gold wire bonding in the field of interconnection of ICs(integrate circuits). This paper presents the recent development including bonding process design,bond strength evaluations,bonding mechanism and modern research method of copper wire bonding. The results and shortage of the present research work are discussed. The trend of copper wire bonding research is also pointed out,which will be helpful for the widely using of copper wire in IC assembly processes and quickly and nicely developing of IC industry in China.
出处
《焊接》
北大核心
2008年第12期15-20,共6页
Welding & Joining
基金
国家自然科学基金(50628506
50705049)资助。
关键词
集成电路封装
铜丝引线键合
工艺
integvate circuit assembly, copper wire bonding, process design
