摘要
随着移动电话及其相关电子产品的竞争日趋激烈,对产品的质量要求越来越高,工艺控制更加严格。针对电池保护板中常用的TAB元件(镍片)在二次回流焊接中的不良原因进行了分析,并对其工艺质量控制进行了说明和讨论。
With the rapidly development of mobile and relevant electronic products, the requirement for quality is higher and higher, and the demand for process control is more strict. Mainly analyze the root reason that the defects of TAB soldering are occurred in two - times reflow and further discuss the methods of process quality control for the TAB used in cell protection boards.
出处
《电子工艺技术》
2009年第1期19-21,共3页
Electronics Process Technology
关键词
电池保护板
镍片
二次回流焊接
工艺控制
Cell protection board
TAB
Two - times reflow
Process
Control
