摘要
利用慢应变速率拉伸试验(SSRT)并结合断口分析,研究了镀银方式、镍阻挡层、表面压应力和温度等因素对TC4钛合金固态银致脆(SSIE)行为的影响,并对SSIE机制进行了理论分析。结果表明,在28×10-6·s-1慢速率提伸条件下,TC4于350℃以上表现出较显著的SSIE敏感性,SSIE下限温度约为280℃。银与TC4表面紧密结合是产生SSIE的必要条件。电镀(EP)银可引起TC4氢脆(HE)和SSIE双重破坏作用。镍阻挡层对TC4的SSIE裂纹萌生有一定抑制作用。TC4合金SSIE过程速率由银在裂纹表面自扩散速率与裂尖氧化膜破裂速率的相对大小决定。
The efect of silver state, nickel barrier, contact pressure and test temperature on the solid silverinduced embrittlement (SSIE) of TC4 alloy was investigated by using slow strain rate tests (SSRT) and fractographic technique. The mechanism of SSIE is discussed in the light of test observation and thermodynamic analysis. TC4 alloy manifests severe embrittlement at temperature above 350℃ when loaded at a tensile strain rate of 2.8×10-6 s-1. The lover limit of embrittlement is about 280℃. Intimate contact between solid silver and TC4 alloy is one of the prequisites for SSIE. Electroplating silver causes both hydrogen embrittlement and silver embritllement. Crack initiation can be repressed in some degree by prior plating a thin layer of nickel onto the surface of TC4 alloy to act as a barrier to silver. The SSIE susceptibility of TC4 alloy depends mainly on the transport rate of silver atoms to the crack tip by surface selfdiffusion of silver on the fracture surface and the cracking rate of oxide film at crack tip.
出处
《稀有金属》
EI
CAS
CSCD
北大核心
1998年第3期195-199,共5页
Chinese Journal of Rare Metals
基金
航空基金
关键词
银脆
氢脆
离子束增强沉积
钛合金
Silver embrittlement, Hydrogen embrittlement, Ionbeamassisted deposition, Titanium alloy