摘要
从浆料的组成和烧成工艺研究瓷介电容器银浆堆烧“粘片”问题。ＤＴＡ和ＳＥＭ分析证实粘片是由于表面银层片间叠压交互烧结形成的，并提出解决方法，以满足生产要求。
Sticking problem of the silver electrodes of DC had been studied with changes in compositions of the silver paste and firing technology. The results by DTA and SEM showed that sticking caused during stack-firing because of diffusion. The methods to resolve sticking problem had been presented. The silver paste studied had meeted the requirements for DC production.
出处
《贵金属》
CAS
CSCD
北大核心
1998年第1期14-17,共4页
Precious Metals
关键词
圆片电容器
银浆
粘结
堆烧
Disk capacitor, Silver paste, Sticking, Firing
