期刊文献+

脉冲电铸制备纳米CeO2增强镍基复合材料 被引量:7

Nano-CeO_2/Ni Composites Prepared by Pulse Electroforming
下载PDF
导出
摘要 用脉冲电铸技术制备了纳米CeO2增强镍基复合材料,研究了镀液中纳米CeO2颗粒添加量、阴极平均电流密度、占空比及脉冲频率对电铸复合材料中CeO2含量的影响,并对复合材料的显微硬度和表面形貌进行了分析。结果表明:在CeO2添加量40 g.L-1、阴极平均电流密度4A.dm-2、占空比0.2、脉冲频率1 000 Hz的条件下,电铸复合材料中CeO2含量最高为2.98%;其显微硬度为484 HV,较脉冲纯镍的323 HV有明显提高;与直流电铸纳米CeO2增强复合材料相比,脉冲电铸制备的复合材料表面更平整,组织更致密,晶粒更细小,且减少了纳米CeO2颗粒的团聚现象。 Ni/nano-CeO2 composites were prepared by pulse electroforming. Effects of concentration of nanoCeO2 particles in the electrolyte, pulse average current density, duty cycle and pulse frequency on the content of CeO2 in the Ni/nano-CeO2 composites were evaluated, The surface morphology and microhardness of composites were also analyzed. The results indicated that under the conditions of CeO2 concentration of 40 g· L-1 in the electrolyte , pulse average current density of 4 A · dm-2, duty cycle of 0. 2 and pulse frequency of 1 000 Hz, the composites containing 2. 98% CeO2 particles had much higher mierohardness (484 HV) than that of the pulse pure Ni(323 HV). The Ni/nano-CeO2 composites prepared by pulse eleetroforming had smoother morphology, more compact microstructure, further refined grains than that of the Ni/nano-CeO2composites prepared by direct electroforming and improved agglomeration of CeO2 particles.
出处 《机械工程材料》 CAS CSCD 北大核心 2009年第1期33-36,共4页 Materials For Mechanical Engineering
基金 国家自然科学基金资助项目(50775067) 河南省高校创新人才基金资助项目(2005-126)
关键词 脉冲电铸 纳米CEO2 镍基复合材料 表面形貌 pulse electroforming nano-CeO2 Ni-based composite surface morphology
  • 相关文献

参考文献7

  • 1朱保国,王振龙.电铸技术的发展及应用[J].电加工与模具,2006(5):1-6. 被引量:28
  • 2李获.电化学原理[M].北京:北京航空航天大学出版社,1999.
  • 3张欢,郭忠诚,韩夏云.脉冲电沉积RE-Ni-W-P-SiC复合镀层工艺[J].机械工程材料,2004,28(7):29-31. 被引量:7
  • 4Fei J Y, Wilcox G D. Electrodeposition of Zn-Co alloys with pulse containing reverse current [J]. Electrochimica Acta, 2005,50 : 2693-2698.
  • 5Chang L M, An M Z, Guo H F, et al. Microstructure and properties of Ni-Co/nano-Al2O3 composite coatings by pulse reversal current electrodeposition[J]. Applied Surface Science, 2006,253:2132-2137.
  • 6Despic A R, Popov K I. Transport Controlled Deposition and Dissolution of Metals in Molten Aspects of Electrochemistry [M]. New York: Plenum Press, 1972.
  • 7Gyttou P, Pavlto E A, Spyellis N,et al. Hardening modification of nickel matrix composite electrocoatings containing SiC nanoparticles[J]. Electroplating & Surface Treatment, 2001,9 (1):23-28.

二级参考文献23

  • 1郭忠诚,朱晓云,杨显万.Corrosion resistance of electrodeposited RE-Ni-W-P-SiC composite coating[J].中国有色金属学会会刊:英文版,2001,11(3):413-416. 被引量:15
  • 2刘益芳,崔宏巍,吕文龙,孙道恒,杨防祖.利用微电铸制作镍悬臂梁[J].厦门大学学报(自然科学版),2005,44(5):658-660. 被引量:1
  • 3Tajiri K, et al. Development of an electroformed copper lining for accelerator components[J ]. Electrochemical Acta, 2001,47 : 143- 148.
  • 4Lee M H, Pimpl M. Development of a new electrodepo-sition method for Pu-determination in environmental samples [J ]. Applied Radiation and Isotopes, 1999,50 : 851 - 857.
  • 5Ghaemia M, Binder L. Effects of direct and pulse current on electrodeposition of manganese dioxide[J]. Journal of Power Sources,2002 , 111:248 - 254.
  • 6Chan K C, et al. Effect of reverse pulse current on the internal stress of eleetroformed nickel[J]. Journal of Materials Processing Technology, 1997,63:819- 822.
  • 7Masanori Kunieda, et al. Rapid prototying by selective electrodeposition using electrolyte Jet[J]. Annals of the CIRP, 1999, 47(1):161- 164.
  • 8Karakus C, Chin D T. Metal distribution in jet plating[J]. J.Electrochem. Soc, 1994, 141(3):691-697.
  • 9Ra'a A. Said. Adaptive tip-withdrawal control for reliable microfabrication by localized electrodeposition [ J ]. Journal of Microelectromechanical Systems, 2004, 13(5) : 822 - 832.
  • 10John D Madden, lan W Hunter. Three-dimensional microfabrication by localized electrochemical deposition[J ]. Journal of Microelectromechanical Systems, 1996, 5(1) : 24 - 32.

共引文献39

同被引文献66

引证文献7

二级引证文献52

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部