摘要
通过计算机模拟的方法对不同温度下Cu//Cu/FeS摩擦副的摩擦性能进行计算研究,结果发现:当环境的温度在500 K时,摩擦副的摩擦系数出现第一个谷值,而此时金属铜发生再结晶,黏着磨损更为明显;700 K时,黏着层数减小而摩擦系数却有所增大,主要是由于复合材料内部的FeS结构发生转变造成.计算结果还证明:在高温情况下,增强相FeS存在先分解再重新结合的2个过程,并指出Cu/FeS复合材料在900 K时,仍然具有很好的减摩耐磨作用.还对不同温度摩擦时复合材料内部的组织演变过程进行系统分析,分析结果表明,随着温度的升高,FeS的结构发生演变,从六方NiAs型超结构相转变为简单NiAs型结构相,并且随着温度的升高,FeS结构的c/a也在不断减小,这些都影响着复合材料的摩擦性能.
Tribological property of Cu//Cu/FeS tribopair under different temperatures was simulated by molecular dynamics. The tribopair exhibited a low value of friction coefficient at 500K, when there was a severe adhesion wear due to recrystallization of Cu. At 700 K, the number of adhesion layers decreased and friction coefficient increased a little, this is because that FeS structured changed. The simulation proved that FeS experienced two processes of decompose and reunite, and Cu/FeS composite exhibited good tribological performance at 900 K. The evolution of structure was analyzed systematically. With increase of temperature, FeS structure changed from hexagonal NiAs- type superstructure to simple NiAs -type phase, and the c/a ratio decreased gradually, which affects the performance of the composite.
出处
《摩擦学学报》
EI
CAS
CSCD
北大核心
2009年第1期43-49,共7页
Tribology
基金
国家科技支撑计划资助重大项目(批准号:2008CB617609)
云南省应用基础研究计划资助重点项目(批准号:2006E0003Z)
关键词
复合材料
摩擦磨损
分子动力学
组织演变
摩擦系数
黏着层数
composite, friction and wear, molecular dynamics simulation, microstructure evolution, frictioncoefficient, layer number of adhesion