稳定剂对低磷化学镀镍液及镀层的影响

Effects of Stabilizers on Stability of Low-P Electroless Nickel Bath and Deposit

在基础低磷化学镀镍液中,分别添加硫脲(TU)、KI、KIO3、含硫有机杂环化合物A和CuSO4等稳定剂,考察其对镀液的稳定性能、镀速、镀层中磷的质量分数和可焊性等的影响。研究表明:化合物A的加入能使镀液稳定性上升,并且可以进一步降低镀层中磷的质量分数。合适稳定剂的加入,不但可以提高镀液的稳定性,同时还能够获得镀速更快、磷的质量分数更低,并且可焊性良好的低磷化学镀镍层。

To basic electroless nickel bath, five electroless nickel bath stabilizers of TU, KI, KIO3, organic heterocyclic compound A containing sulfur, and CuSO4 were added respectively, and the effects of these five stabilizers on the stability of electroless nickel bath, deposition rate, the mass fraction of P and soldering capability of the layer were investigated. The results show that A is an excellent electroless nickel bath stabilizer, which can not only stabilize the bath very well but also decrease the mass fraction of P of the layer. An appropriate stabilizer can improve the stability of the bath, and get a bigher deposition rate and a layer with lower mass fraction of P and good soldering capability at the same time.