高择优锌-镍合金电沉积的现场ECSTM研究

In Situ Studies of Highly Oriented Zn Ni Alloy Electroplating by Using ECSTM

采用“二步包封”法制备了性能良好的电化学ＳＴＭ针尖．以此为基础采用ＥＣＳＴＭ现场研究了工艺条件下ＨＯＰＧ上高择优锌－镍合金的电沉积过程．研究结果表明这种高择优沉积层以侧向生长方式生长，而表面上电化学活性差的晶面构成了晶体生长过程的保留面，从而进一步形成了与基底表面方向一致的高择优沉积层，Ｘ射线研究表明这一择优面为（１００）晶面．

Based on a very effective “two step coating” method developed for ECSTM tip preparation, highly oriented Zn Ni alloy electroplating was studied by in situ ECSTM. The in situ ECSTM observation showed a 3 D growth of the Zn Ni alloy crystal in the absence of the additives. However, when additive AA 1/DIE was introduced to the plating solution, the Zn Ni alloy crystal grew along the step and layer by layer. This result indicated that the crystal plane of lower electrochemical activity may be reserved to form the highly oriented layer along the surface of the electrode. The X ray diffraction patterns showed a highly oriented (100) crystal plane of the deposition along the electrode surface in the presence of AA 1/DIE additive.