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Cu-2.0Ni-0.5Si合金形变热处理及强化机理分析 被引量:9

Thermomechanical Treatment and Strengthening Mechanism of Cu-2.0Ni-0.5Si Alloy
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摘要 研究了不同形变热处理条件下Cu-2.0Ni-0.5Si合金的性能,对合金的显微硬度和电导率进行测量,采用透射电镜及电子衍射分析其显微组织。结果表明,时效前的冷变形可以加速时效析出过程,在时效初期尤为明显;在450℃时效时合金有3种强化机制:调幅组织强化、位错强化、析出的第二相粒子强化。随着变形量的增加硬度的峰值也会增加,但对电导率影响不大。变形量为80%时其显微硬度达到248HV,相对电导率达38.5%IACS。 The properties of Cu-2.0Ni-0.5Si alloy under different heat treatment conditions were examined by the microhardness and electrical conductivity, transmission electron microscope. The results show that the cold deformation before aging can promote ageing precipitation, especially at the early stage of aging. The strengthening mechanisms of Cu-2.0Ni-0.5Si alloy at 450 ~C are the combined effect of spinodal strengthening, dislocation strengthening and the second precipitation phase strengthening The peak microhardness increase with increasing deformation, but the deformation has a little effect on the electrical conductivity. The microhardness and electrical conductivity of Cu-Ni-Si alloy achieved 248 HV and 38.5% IACS, respectively at deformation of 80%.
出处 《铸造技术》 CAS 北大核心 2009年第1期38-40,共3页 Foundry Technology
基金 国家863计划(2006AA03Z528) 河南省杰出青年基金(0521001200)
关键词 CU-NI-SI合金 时效 显微硬度 电导率 Cu-Ni-Si alloy Aging Microhardness Electric conductivity
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