摘要
随着表面安装技术的迅速发展,新的封装技术不断出现,面积阵列封装技术成了现代封装的热门话题,而BGA/CSP和倒装焊芯片(Flip Chip)是面积阵列封装主流类型。BGA/CSP和倒装焊芯片的出现,适应了表面安装技术的需要,解决了高密度、高性能、多功能及高I/O数应用的封装难题。本文介绍了BGA/CSP和倒装焊芯片的封装理论和技术优势及制造流程,并阐述了植球机的基本构成和工作原理。
With the rapid development of surface mounting technology, new packaging technologies arise continually and area array packaging technology becomes the main topics of contemporary packages. BGA/CSP and Flip Chip are two of the main area array types. BGA/CSP and flip chip meet the demand of surface mount technology, and resolve the applications with high density, high performance, multiple functions and high I/O counts. In this article, many issues of BGA/CSP and flip chip, such as structure, type, application, development etc are described and introduced. The ball mounting system＇ s structure and principle are also introduced.
出处
《中国集成电路》
2009年第2期49-55,共7页
China lntegrated Circuit
