期刊文献+

MiniSKiiP~IPM面向中等功率应用的先进模块架构

MiniSKiiP~ IPM-Advanced Module Architecture for Medium-Power Applications
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摘要 电力电子技术可以帮助提高能源效率和节约大量能源,尤其是在中等功率应用市场中。得益于其高集成度和简单的组装,本文所介绍的600V智能IGBT功率模块能够促进电力电子的应用。该模块的特点在于其基于双极性电平转换器的先进概念。因此,所集成SOI驱动器不受参考电压变化的影响,输出功率高达15kW,从而提高了在应用中的可靠性。 Power electronics can help boost energy efficiency and achieve considerable energy savings, especially in the market for medium-power applications. The intelligent 600V IGBT power module presented here facilitates the use of power electronics thanks to its high integration density and simple assembly. This module features an advanced concept based on bipolar level shifters. As a result, the integrated SOI driver is immune to changes in referential voltage, thus providing a high level of reliability in applications with an output power of up to 15kW.
机构地区 赛米控
出处 《电源世界》 2009年第1期49-52,109,共4页 The World of Power Supply
关键词 IPM(智能功率模块) 无基板模块 弹簧触点 SOI驱动器 IPM, Modules without baseplate, Spring contacts, SOI drivers
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参考文献3

  • 1U.Scheuermann,,P.Beckedahl.The Road to the Next Generation Power Module 100% Solder Free Design[].ProcCIPS ETG-Fachbericht.2008
  • 2F.Lang,,U.Scheuermann.Reliability of Spring Pres- sure Contacts under Environmental Stress[].Microelec- tronics Reliability.2007
  • 3B.Vogler,,M.Ro?berg,,R.Herzer,,L.Reu?er,,T.Wurm.600V Converter/Inverter/Brake (CIB) Module with integrated SOI Gate Driver IC for Medium-Power Applications[].ProcCIPS ETG-Fachbericht.2008

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