摘要
多层印制板基材的玻璃化温度、Z轴膨胀系数、热裂解温度、热分层时间及层压板固化度ΔTg大小是印制板生产厂家极为关注的主要产品性能。多层板件翘曲和尺寸胀缩变化亦是多层板生产中最常见而又最难解决的产品缺陷之一。系列试验表明这些问题均与层压板残余热应力有关,而残余应力的产生与板料树脂配方、PCB线路分布均衡性、PCB制程条件等相关。文章在简要介绍层压板残余热应力产生的基础上,重点阐述了从优化层压工艺的角度出发,采用热压释放残余应力,改善多层印制板ΔTg、板件翘曲、尺寸涨缩及耐热性等多方面性能。
Glass transition temp（Tg）, Z-axis thermal exp（ZCFE）, thermal decomposition temp（Td）, delamination time（T260/T288/T300） and degree of cure（△Tg） of the laminated boards are the deep concerned product properties. PCB warpage and dimentional stability are also the ordinary bug in production of multilayer PCB. The major factor about these problems is residual hot-pressing stress, and this stress is related with resin formula, distribution of circuit line on PCB as well as PCB production conditions. This article introduces the cause of residual hot-pressing stress of laminated board in theory and practical production, provides a method to control and improve △Tg, warpage, dimentional stability and thermal resistance of multilayer PCB by relieving residual hot-pressing stress.
出处
《印制电路信息》
2009年第2期46-51,共6页
Printed Circuit Information
关键词
多层印制板
层压
热压残余热应力
翘曲
multilayer printed circuit board
laminating
residual hot-pressing stress
warpage
