摘要
本文介绍了在纳米硬度计上进行的单晶硅微压痕测试实验及结果分析,以对单晶硅的微观力学性能有所认识。微压痕测试表明:单晶硅的弹性模量在压入载荷小于2400μN的范围内随载荷变化而波动变化;而在压入载荷大于2400μN后保持相对的稳定值(约为214GPa);单晶硅的表面硬度在压入载荷小于1000μN的范围内随载荷变化而线性增大,而后突然降低并保持相对的稳定值(13.5GPa～15GPa);单晶硅在纳米压入过程中,材料的破坏形式为脆性破裂,并且随压入载荷的增大而在压痕边沿产生堆积,堆积程度亦逐渐增大。
In order to evaluate the micro mechanical properties of single crystal silicon which are commonly applied for MEMS, a serial of nano- indentation were performed on TriboIndentcr,a full featured nano-mechanical test instrument. The results revealed that the micro-mechanical properties of single crystal silicon show the characteristic of load-dependence under a certain micro normal load, and pile-up and brittle failure occurred on single crystal silicon against micro deformation
出处
《科技信息》
2008年第34期336-337,共2页
Science & Technology Information
关键词
单晶硅
微压痕
微观力学性能
Single crystal silicon
Nano-indentation
Micro-mechanical property
