不同品质的焦磷酸盐对电镀铜的影响

Effect of pyrophosphate quality on copper electroplating

采用赫尔槽试验、哈林阴极法、贴滤纸法及稳态阴极极化测量,研究了分别由ACTI和普通国产焦磷酸盐配制的镀铜液的性能差别,采用络合能力指数(CAI)对不同品质焦磷酸钾的络合能力进行评价。结果表明,采用络合能力指数高的ACTI焦磷酸盐配制的镀铜液,其分散能力、络合能力和镀层致密性、孔隙率均优于以络合能力指数低的普通焦磷酸盐配制的镀铜液。杂质正磷酸根离子严重影响ACTI焦磷酸盐镀铜液的极化性能:随着其质量浓度增大,槽电压升高,镀液的络合能力降低。三聚磷酸根离子对ACTI焦磷酸盐镀铜液的极化性能影响不大。

The performance differences between the Cu plating baths prepared respectively with ACTI and ordinary China-made pyrophosphates were studied by Hull cell test, Haring cell method, filter paper method and steady-state cathodic polarization measurement. The complexing capabilities of potassium pyrophosphates of different qualities were evaluated by determination of complexing capability index （CAI）. The results showed that the Cu plating bath prepared with ACTI pyrophosphate has higher throwing power and complexing capability than that prepared with ordinary pyrophosphate, producing Cu deposits with better compactness and less porosity. Orthophosphate ions, as impurities, greatly affect the polarization of ACTI pyrophosphate Cu plating bath. The increase in the mass concentration of orthophosphate results in an increased cell voltage and a decreased complexing capability of the bath. Tripolyphosphate ions have a slight effect on the polarization ofACTI pyrophosphate Cu plating bath.