大功率LED阵列的热沉结构设计和参数优化

Design of the heat sinking structure and parameters optimization in high-power LED array

大功率LED是一种新型的照明光源,散热问题是研制大功率LED的关键技术之一.采用微通道制冷技术,设计了大功率LED阵列的外部热沉.提出采用交错结构的微通道,可以增加热交换系数,减小通道中流体压力的下降,从而提高散热性,同时可以减少直通道结构在制作和安装过程中造成微通道断裂的可能性.针对交错结构的微通道,理论分析了影响其热阻的因素,推导了热阻表达式,并对微通道散热器的结构参数进行了优化,当通道宽度取到某一数值时,散热器的热阻可达到最小.

High-power LED is a new candidate for general illumination applications. The heat dissipation is a key problem for high-power LED. The outside heat sinking of high-power LED arrays is designed using micro-channel refrigeration technology. The micro-channel with staggered structure is used to enhance the heat transfer coefficient and reduce the fluid pressure drop in channel. It will achieve good thermal performance and reduce the possibility of channel fracture during the process of manufacture and installation. Focusing on the micro-channel with staggered structure, the thermal resistance factors are analyzed theoretically, the express of thermal resistance is proposed, and the structure parameters have been optimized. When the width of channel reaches an optimum value, the thermal resistance in the cooler will be minimum.