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单片行波功率放大器 被引量:3

A Monolithic Traveling Wave Power Amplifier
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摘要 报道了一个单片行波功率放大器的研究结果。单级放大器电路采用6个栅宽为420μn的GaAsMESFET作为有源器件,通过采用栅串联电容和漏线阻抗渐变技术,在(1-13)GHz频率范围内线性增益为7.5±0.5dB,输出功率大于0.5W,功率附加效率为16%,输入输出驻波比在1.2—2,1之间。采用离子注入、背面通孔等先进工艺制作在厚度为0.1mm的GaAs基片上,芯片面积为3.7mm×1.85mm。将两个这样的芯片级联得到13±1dB的线性增益。 This paper describes the design, fabrication and performance, of amonolithic GaAs Power Traveling Wave Amplifier (TWA) with 7. 5 dB liner gainand 0. 5 dB gain flatness in (1─13) GHz frequency range. The main mechanismswhich limit power capability of the TWA are discussed. By using the techniques ofseries gate capacitors and tapering drain line impedance, the amplifier has achieved0. 5 W output power with 16 percent power-added efficiency over the band. TheMMIC uses 6 × 420 μm MESFETs as active devices and is implemented on 0.1 mmGaAs substrate. The chip size is 3. 7 mm ×1. 85 mm. By cascading two chips,13±1 dB linear gain over the same band is obtained.
出处 《固体电子学研究与进展》 CAS CSCD 北大核心 1998年第1期3-8,共6页 Research & Progress of SSE
关键词 微波集成电路 行波功率放大器 砷化镓 MMIC Power TWA CaAs MESFET Broad Band
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同被引文献16

  • 1陈雪军,林金庭,陈克金.单片行波功率放大器[J].固体电子学研究与进展,1996,16(4):418-418. 被引量:2
  • 2中国集成电路大全编委会.微波集成电路[M].北京:国防工业出版社,2000.
  • 3PERCIVAL W S. Thermionic valve circuits: British, 460562 [P]. 1937-01.
  • 4ARCHER J A, PETZ F A, WEIDLICH H P. GaAs FET distributed amplifier [ J ]. Electronics Letters, 1981, 17 (13): 433-434.
  • 5SALEH B A, TEICH M C. Fundamentals of photonics: British, 460563 [P]. 1937-01.
  • 6VIRDEE B S, VIRDEE A S, BANYAMIN B Y. Broad- band microwave amplifiers [ M ]. London: Artech House, 2004.
  • 7BURNS L M. Application for GaAs and silicon integrated circuit in next generation wireless communication system [J]. IEEE Solid-State Circuits, 1995, 30 (10) : 1088- 1095.
  • 8BAHII,BHARTIAP.微波固态电路设计[M].郑新,赵玉洁,刘永宁,等译.2版.北京:电子工业出版社,2006:372-375.
  • 9VIRDEE B S, VIRDEE A S, BANYAMIN B Y. Broad- band microwave amplifier [ M ]. London: Artech House Inc., 2004: 119-175.
  • 10BURNS L M. Application for GaAs and silicon integrated circuits in next generation wireless communication systems [J]. IEEE Journal of Solid-State Circuits, 1995, 30(10): 1088-1095.

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