摘要
为解决电源模块的热可靠性问题,利用有限元热分析软件ANSYS对其进行热分析,得到整个模块的温度场分布情况;分析了模块中各生热元件的温升及其之间的热耦合情况;根据热分析结果提出热设计方法。最后,对模块各部分进行重新布局,证实了重新布局后的模块就其热可靠性而言更为合理。
Thermal conditions of DC/DC power module was analyzed by using finite element thermal analysis software ANSYS to address thermal reliability issues of the module. Temperature distribution over the entire module was obtained, and heat rise of self-heating devices in the module and thermal coupling among them were analyzed. Thermal design methods based on the analysis were proposed. Finally, devices in the module were rearranged, which proved to be more reasonable as far as thermal reliability was concered.
出处
《微电子学》
CAS
CSCD
北大核心
2009年第1期101-104,共4页
Microelectronics
