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Al_2O_3弥散强化铜与T2铜的真空钎焊研究 被引量:4

Study on Vacuum Brazing of Al_2O_3 Dispersion-strengthen Copper and Copper T2
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摘要 用Ag-Cu-Ti钎料对Al2O3弥散强化铜与T2铜进行真空钎焊。研究了钎焊温度和保温时间对钎焊接头组织和性能的影响。结果表明:温度过低,钎料与母材相互冶金作用不强,结合不紧密;温度过高和保温时间过长,钎料向Al2O3弥散强化铜中毛细渗入严重,钎缝出现虚焊,接头强度下降。钎缝组织主要为Cu的固溶体与Ag的固溶体。 The article was about vacuum brazing of Al2O3 dispersion-strengthen copper and copper T2 with the filler Ag-Cu-Ti. The influence of brazing temperature and holding time on microstructure and tensile strength was studied. It shows: As the temperature is lower, metallurgical action between the filler and the base metals is not good, so the bond is not firm. As the temperature is bigher, the filler leaks into Al2O3 dispersion-strengthen copper seriously, so the voids appear in the brazed joint, and the tensile strength decreases. The main structures in the brazed seam are Cu and Ag solid solutions.
出处 《热加工工艺》 CSCD 北大核心 2009年第3期108-110,113,共4页 Hot Working Technology
关键词 Al2O3弥散强化铜 T2铜 真空钎焊 抗拉强度 显微组织 Al2O3 dispersion-strengthen copper vacuum brazing tensile strength microstructure
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参考文献7

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二级参考文献18

共引文献12

同被引文献17

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