摘要
为了开发新的电动和混合动力驱动交通工具需要的功率半导体模块,要有新的模块集成和封装解决方案。文章介绍了SKiM^(?)功率模块,是采用无基板压接触点的模块,确保了出色的热循环能力和低的热阻。
New solution for module integration and assembly has that are necessary for new electric vehicles and hybrid vehicles to be found to explore power semiconductor modules This articles introduces SKiM power module, which uses modules that have contact points without base-plates, thus promising excellent thermal circulation ability and low thermal resistance
出处
《电源世界》
2009年第2期49-51,共3页
The World of Power Supply
关键词
功率模块
弹簧触点
无基板
热阻
Power module, Spring contact, Without base-plates, Thermal resistance