软硬件混成模块化SoC集成方法

Integration method of system on chip based on hardware/software hybrid module

针对现有SoC软硬件协同设计方法学模块复用率低、软硬件整合困难,提出了有利于设计团队管理和任务划分的软硬件混成模块化集成思想,并结合国产微处理器给出了SoC三阶段集成方法。给出了具体的设计阶段划分及任务,设计团队知识结构和任务调度的基本方法,以及EDA工具链实例。该集成方法已通过逻辑仿真与物理仿真的验证。

A novel method on integration of system on chip is presented to deal with the problem on the lower reuse rate and the higher complexity of hardware/software integration of hardware/software co-design methodology. This three stages method based on hardware/ software hybrid module, is beneficial for management of the design team and portioning of the design tasks. Based on a system on chip with china-made microprocessor, the partition and tasks of design stages, team knowledge structure, tasks scheduling and tools organization in detail. The method is proven by logic simulation and FPGA emulation.