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P沟MOSFET/FIPOS的γ射线总剂量辐照特性

Total dose γ-ray radiation characteristics of P-channel MOSFET/FIPOS
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摘要 采用高选择和自终止多孔氧化硅全隔离技术制备了高质量的SOI材料。研究了在该材料上采用2μmCMOS工艺制备的不同沟道长度的P沟MOSFET的60Coγ射线总剂量辐照特性,表明经5kGy(Si)辐照后,器件仍有特性,但阈值电压有较大的漂移,这主要是由栅氧化层中的辐照感生电荷而引起。不同沟道长度PMOSFET的辐照特性基本相同。经一段时间室温退火,阈值电压出现回漂。 The high quality SOI(silicon on insulator) materials were prepared with highly selective and self-stopping full isolation by porous oxidized silicon(FIPOS) technology. The PMOSFETs with different channel lengths were fabricated by the 2 μm CMOS process on the SOI wafers and their total dose 60Co γ- ray radiation characterietics were studied. The reaults show that the devices remain functional after 5kGy(Si) dose radiation, but the threshold voltage has a significant shift. The main factor causing this shift is the radiation- induced trapped- oxide charge in the gate oxide layer. The devices with different channel lengths have similar radiation characteristics. After room- temperature annealing for several hours, the threshold voltage has a little back- shift.
出处 《核技术》 EI CAS CSCD 北大核心 1998年第1期43-47,共5页 Nuclear Techniques
关键词 SOI材料 PMOSFET 总剂量辐照 Γ射线 CMOS FIPOS, SOI material, PMOSFET, Total dose radiation
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参考文献3

  • 1黄宜平,半导体学报,1997年,18卷,12期
  • 2竺士炀,固体电子学研究与进展,1996年,16卷,3期,277页
  • 3Ma T P,Ionizing radiation effects on MOS devices and circuits,1989年

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