摘要
国际大厂如索尼、苹果、惠普、戴尔等先后制订出无卤转化时间表,将大大加速电子产品的无卤化进程。近年来,在市场应用与环境立法的驱动下,无卤PCB基板材料的使用正在迅速发展。除环境考量以外,随着信息技术的发展,电子通讯频率将越来越高,对PCB基板材料而言,适应高速/高频的要求越来越迫切。文章分析了台湾台耀科技的低传输损失无卤PCB基板材料,同时,还介绍了日立化成的低传输损失的无卤材料MCL-LZ-71G、MCL-HE-679G的性能特点。
The globalization enterprises like Sony, Apple, HP, and Dell further raise their transition schedule to completely rule out the halogen element existing in their product. Over these years, market trend and government regulation have lead to the introduction of halogen free material. Besides environmental consideration, frequency of communication is getting higher and higher with development of information technology. Requirement of PCB base material for high speed/high frequency is getting exigent. In the paper, the new low transmission loss halogen free material from TUC was analyzed. At the same, characteristic of MCL-LZ-7 IG and MCL-HE-679G from Hitachi Chemical was introduced.
出处
《覆铜板资讯》
2009年第1期16-22,38,共8页
Copper Clad Laminate Information
关键词
无卤
PCB基板材料
耐热
低传输损失
Halogen-free
copper clad laminate
thermal resistance
low transmission loss
