摘要
SIP(System in Package),指系统级封装。特点是将不同功能的有源电子元器件加上无源或类似MEMS的光学器件集中于一个单一封装体内,构成一个类似系统的器件为系统或子系统提供多种功能。它与系统级芯片(SOC)互补,实现混合集成,具有设计灵活、周期短、成本低的特点。文章通过系统封装技术的研发历程,评价了封装的优越性、探讨了此种封装技术的产品架构和相关技术及其发展前景。
System in package （SIP） is characterized by any combination of more than one active electronic component of different functionality plus optionally passives and other devices like MEMS or optical components assembled preferred into a single standard package that provides multiple functions associated with a system or sub-system. It uses mature sealing process to integrate many kinds of primary devices with system on chip （SOC） supplementary to realize the hybrid integration. SIP futures design flexible, short cycle and low cost. This article describes development and the superiority SIP, and to discuss the SIP product structure. And also the correlation technology and the future prospects are given.
出处
《电子与封装》
2009年第2期5-10,共6页
Electronics & Packaging
关键词
系统级封装
混合集成
发展前景
system in package
hybrid integrated
development prospects
