摘要
系统级封装(SIP)技术从20世纪90年代初提出到现在,经过十几年的发展,已经被学术界和工业界广泛接受,成为电子技术研究新热点和技术应用的主要方向之一,并认为它代表了今后电子技术发展的方向,SIP封装工艺作为SIP封装技术的重要组成部分,这些年来在不断的创新中得到了长足的发展,逐渐形成了自己的技术体系,值得从事相关技术行业的技术人员和学者进行研究和学习,文章从封装工艺角度出发,对SIP封装制造进行了详细的介绍,另外也对其工艺要点进行了详细的探讨。
System-in-Package （SIP）technology from the early 1990s made up to now, after more than a decade of development, has extensive academic and industry acceptance and become the new hot technology and one of the major directions, it represents the future direction of the development of electronic technology, SIPpackaging technology as a SIPpackaging technology an important component, the years of constant innovation has grown by leaps and bounds, and has gradually formed its own technology system, should be engaged in technology-related industry, technicians and academics to conduct research and study, In this paper, packaging technology from the point of view of the package to create a detailed, as well as on the process were the main points of concern, this article would like to be able to work in this field technicians provide valuable technical information.
出处
《电子与封装》
2009年第2期11-15,共5页
Electronics & Packaging
关键词
封装工艺
表面处理
封装基板
packaging technology
surface treatment
package substrate
