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基于多芯片组装技术的小型微波收发前端研制 被引量:4

Development of a Miniature T/R Front-end Using Microwave Multi-Chip Module Technology
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摘要 多芯片组装(MCM)技术是目前实现雷达微波前端小型化的有效途径。利用MCM技术,研制了一种小型化微波收发前端。着重分析了接收机前端结构设计与微组装电路实现。测试结果表明,此收发前端具有较小的体积和优良的性能,满足雷达整机小型化要求。 Multi-Chip Module(MCM) is an effective method for realizing the miniaturization of radar microwave front-end. Using microwave MCM technology, a miniature receiver-transmitter front-end is developed. The analysis of the structure design and its MCM circuit realization are introduced in detail. The experimental results show that the T/R front-end can satisfy the requirements of the miniature radar system with small cubage and good performance.
作者 王锋 李中云
出处 《信息与电子工程》 2009年第1期25-27,40,共4页 information and electronic engineering
关键词 小型化 多芯片组装 收发前端 miniature Multi-Chip Module T/R front-end
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