爆炸逻辑网络封装技术研究

Sealing Technology of Explosive Logic Circuits

为了解决爆炸逻辑网络低温传爆不稳定、封装可操作性差等问题,进行了光固化胶粘接性能以及光固化胶封装炸药网络低温传爆性能研究,得出适合网络封装的光固化胶;在光固化胶中添加低温调节剂,可使光固化胶低温粘接效果更好,并满足低温试验要求。

To solve the problem of unstable transmission of detonation of explosive logic circuits under low temperature and its bad operation in sealing, several light-solid adhesives and their characteristics are researched, circuits covered with them are tested under low temperature. Based on the test results, the light-solid adhesive which is suitable for the circuits sealing is found. While adding low temperature adjusting agent to light solid adhesive, the low temperature adhesion effect of light-solid adhesive is better, and it meets with the requirement of low temperature test.