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Composite-Collector InGaAs/InP Double Heterostructure Bipolar Transistors with Current-Gain Cutoff Frequency of 242 GHz 被引量:4

Composite-Collector InGaAs/InP Double Heterostructure Bipolar Transistors with Current-Gain Cutoff Frequency of 242 GHz
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摘要 To eliminate the conduction band spike at the base-collector interface, an InP/InGaAs double heterostructure bipolar transistor (DHBT) with an InGaAsP composite collector is designed and fabricated using the conventional mesa structure. The DHBT with emitter area of 1.6×15μm^2 exhibits current-gain cutoff frequency ft = 242 OHz at the high collector current density Jc = 2.1 mA/μm^2, which is to our knowledge the highest ft reported for the mesa InP DHBT in China. The breakdown voltage in common-emitter configuration is more than 5 V. The high-speed InP/InGaAs DHBT with high current density digital circuits. is very suitable for the application in ultra high-speed To eliminate the conduction band spike at the base-collector interface, an InP/InGaAs double heterostructure bipolar transistor (DHBT) with an InGaAsP composite collector is designed and fabricated using the conventional mesa structure. The DHBT with emitter area of 1.6×15μm^2 exhibits current-gain cutoff frequency ft = 242 OHz at the high collector current density Jc = 2.1 mA/μm^2, which is to our knowledge the highest ft reported for the mesa InP DHBT in China. The breakdown voltage in common-emitter configuration is more than 5 V. The high-speed InP/InGaAs DHBT with high current density digital circuits. is very suitable for the application in ultra high-speed
出处 《Chinese Physics Letters》 SCIE CAS CSCD 2009年第3期298-301,共4页 中国物理快报(英文版)
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  • 1Griffith Z, Dahlstrom M, Rodwell M J W, Urteaga M, Pierson R, Rowell P, Brar B, Lee S, Nguyen N and Nguyen C 2004 Bipolar/BiCMOS Circuits and Technology Meeting (Montreal, Canada 13-14 September 2004) p 176
  • 2Paidi V, Griffith Z, Wei Y, Dahlstrom M, Parthasarathy N, Urteaga M and Rodwell M J W 2004 IEEE Radio Frequency Integrated Circuits Symposium(Texas, USA 6-8 June 2004) p 189
  • 3Sugeng B R A, Wei C J and Hwang J C M 1993 IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices & Circuits (Cornell University, USA 2-4 August 1993) p 52
  • 4Dahlstrom M 2003 PhD Thesis (University of California, Santa Barbara, USA)
  • 5Jin Z, Su Y B, Cheng W, Liu X Y, Xu A H and Qi M 2008 Chin. Phys. Lett. 25 2683
  • 6Jin Z and Liu X Y 2008 Sci. Chin. E 51 (accepted)
  • 7Griffith Z, Dahlstrom M, Urteaga M, Rodwell M J W, Fang X M, Lubyshev D, Wu Y, Fastenau J M and Liu W K 2004 IEEE Electron. Device Lett. 25 250
  • 8Kurishima K, Ida M and Watanabe M 2002 International Conference on Solid State Devices and Materials (Nagoya, Japan, 17-19 September 2002) p 272
  • 9Kim Y M, Dahlstrom M, Lee S, Rodwell M J W and Gossard A C 2002 IEEE Electron. Device Lett. 23 297
  • 10Jin Z, Prost W, Neumann S and Tegude F J 2004 Appl. Phys. Lett. 84 2910

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