摘要
通过扫描电镜和XEDS分析,对含Cu、As和Sn残余元素的低合金连铸坯中Cu、As和Sn的氧化富集机理进行了研究。结果表明:氧化温度在1250~1150℃时,氧化层中包裹一定量的Cu、As和Sn残余元素;氧化温度在1100—1000℃时,氧化层与基体界面存在明显的Cu、As和Sn富集相;随氧化温度升高,氧化层厚度明显增加。影响连铸坯中Cu、As和Sn富集的主要因素是氧化温度。
The oxidation enrichment mechanism of the residual elements like Cu.As and Sn in the continuously casting slabs were investigated by scanning electron microscope and X - EDS analysis. The test result shows that: a certain amount of residual elements Cu, As and Sn were wrapped in the oxidation layer at the oxidation temperatures between 1 250℃ and 1 150 ℃ ,apparent enrichment phases of Cu, As and Sn existed in the interface of oxidation layer and steel matrix at oxidation temperatures between 1100℃ and 1000℃ ; With the increase of the oxidation temperature, the thickness of oxidation layer was increased. The oxidation temperature was the main causes for the Cu,As and Sn enrichment.
出处
《宽厚板》
2009年第1期21-25,共5页
Wide and Heavy Plate
关键词
残余元素
富集相
选择氧化
低合金钢
Residual elements, Enrichment phase, Selective oxidation, Low alloy steel