带温度补偿结构的高灵敏度光读出红外成像阵列器件设计

Design of high sensitivity optically readable infrared imaging array device with temperature compensation beams

本文提出了一种光读出红外成像阵列器件的结构设计,该设计提高了器件的热-机械灵敏度,同时能有效降低周围环境温度变化所带来的影响。理论计算表明,该阵列器件的关键性能指标热-机械灵敏度和噪声等效温差分别为2.39×10-3和2.42,此外,ANSYS模拟仿真的结果验证了该设计能抑制周围环境温度波动对器件红外目标探测的影响。

A novel optically readable infi＇ared imaging array device with ＂Temperature compensation beams＂ pixels has been proposed. The pixel not only has high sensitivity to infrared radiations, but also has excellent characteristic to reduce the negative influence induced by the fluctuation of environmental temperature. The geometric parameters of the structure have been designed and optimized by investigating the relations between them and some relative performances. Thermal -mechanical sensitivity and NETD of the device designed are estimated as 2.39 × 10^-3and 2.4respectively. The compensation characteristic of the ＂Temperature compensation beams＂ has been proved through ANSYS simulation.