小麦面团及其制品的热导率

Thermal Conductivity of Wheat Flour Dough and Its Products

食品的热导率是预测热加工过程中导热速率的一个重要热特性参数,也是进行加工过程模拟和产品质量控制的基础。通过对1990年以来有关小麦面团及其制品热导率的测定结果进行了汇总,给出其温度、水分、孔隙度和测定方法。论述了温度、水分含量以及结构特性对热导率的影响,对热导率结构模型的最新研究进展及其在面团制品中的应用作了重点介绍并对今后的研究方向作了展望。

Thermal conductivity of food material is one of the important thermal property parameters used to estimate the rate of conductive heat transfer during thermal processes. It is also vital for modeling food processes and controlling the quality of final products. Wheat flour - based foods make the main diet of Chinese. The measured values of thermal conductivity of wheat flour dough and its products since 1990 are reviewed, and the temperature, moisture content, porous state, and the measurement methods are also presented as detail as possible. The effects of temperature, moisture content, and structure properties on the thermal conductivity are discussed, with especially focusing on recent advance in structure models of thermal conductivity and their application in dough products. Finally, future research needs are outlined.