摘要
在田口实验法的基础上,采用非线性有限元建模,对温度循环载荷作用下的PBGA无铅焊点进行可靠性优化研究。L18(21×37)田口正交表被选用来分析PBGA封装体的8个控制因子,包括PCB的尺寸和厚度、基板的尺寸和厚度、焊点的直径和高度、芯片以及塑封的厚度。通过田口实验法,得出了关于PBGA最佳的结构参数组合,其中最重要的控制因子为基板厚度和焊点高度,最佳参数分别为0.66mm和0.60mm。
On the basis of Taguchi method, the thermal reliability optimzation of PBGA lead-free solder joint was studied under temperature cycling loads by nonlinear finite element simulation. L18（2^1×3^7） Taguchi orthogonal table was used to analyze 8 control factors of PBGA, including the sizes and thickness of PCB and substrate, the diameter and height of solder joints, thicknesses of the chip and EMC. Thuough Taguchi test method, the best combination of structure parameters of PBGA was gained, substrate thickness and solder joint height are two most important control factors in them, the best parameter values are 0.66 mm and 0.60 mm, respectively.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第3期64-67,共4页
Electronic Components And Materials
基金
广西自然科学基金资助项目(No.0339037)
江苏省青蓝工程中青年学术带头人基金资助项目
关键词
PBGA
无铅焊点
田口实验法
热可靠性
PBGA
lead-free solder joint
Taguchi experiment method
thermal reliability
