摘要
提出采用GA-BP贝叶斯算法来建立优化设计近似模型。该算法是一种新型神经网络训练算法,它以提高网络的泛化性能为主旨,其训练目标是获取对应于后验分布最大值的权值向量。以方形扁平封装器件为例,采用GA-BP贝叶斯算法建立了温度场分析的近似模型,基于它对封装散热结构进行了优化,并与L-MBP算法进行了对比。结果表明,基于GA-BP贝叶斯算法的温度场分析近似模型,对芯片中心温度的预测精度更为理想,并且受随机因素的影响很小。GA-BP贝叶斯算法克服了现有网络训练算法对初始权值敏感、建模精度不高的缺点,在工程优化设计中具有实用价值。
The GA-BP Bayesian algorithm is used to establish the approximation model for optimization design.This algorithm is a new NN training algorithm developed by the authors.Its aim is to improve the generalization ability of neural networks,and it trains a network with the purpose of obtaining the weights corresponding with the maximum posterior probability.Taking a quad flat package for example,the GA-BP Bayesian algorithm was used to establish the temperature-field analysis approximation model.Then the optimization design of the heat-dissipating structure was carried out based on it,and the comparison with the L-M backpropagation was made.The results show that the temperature-field analysis approximation models based on GA-BP Bayesian algorithm have higher prediction accuracy for chip center temperature,and that the prediction accuracy they have can hardly be effected by random factors.The GA-BP Bayesian algorithm overcomes the shortcomings of the current algorithms,such as the high sensitiveness to initial weights and the unsatisfactory modeling accuracy,and it is valuable in engineering optimization design.
出处
《计算机工程与应用》
CSCD
北大核心
2009年第8期5-8,12,共5页
Computer Engineering and Applications
基金
国家高技术研究发展计划(863)No.2006AA04Z405~~
关键词
优化设计
热设计
神经网络
optimization design
thermal design
Neural Network(NN)