摘要
温度和热应力是引起印刷电路板功能失效的重要原因,针对某电子设备的PCB,对其温度-应力耦合场进行有限元分析,找出了印刷电路最大可能的失效区域;采用DOE方法对元器件结构布局进行了优化设计,使离面正负最大变形量达到最小值,应力集中得到了改善,提高了PCB的使用寿命。
Temperature and thermal stresses are the main causes of the functional failure of a printed circuit board. The finite element analysis of the temperature-stress coupled field of a PCB in an electronic equipment showed the most possible failure region of the printed circuit board. The structural distribution of the components were optimized with DOE method to minimize the positive and negative off-surface deformation maximums and improve the stress concentration to increase the life of printed circuit boards.
出处
《电子产品可靠性与环境试验》
2009年第1期37-42,共6页
Electronic Product Reliability and Environmental Testing
基金
河南省教育厅自然科学基金项目(2007460007)资助
